John G. Webster (Editor) 's 21.Electronic Materials PDF

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F. A. , J. Mater. , 23: 2273–2280, 1988. 67. I. Kawakatsu and S. Kitayame, Trans. Jpn. Inst. Metals, 18, 455– 465, 1977. 68. W. C. Johnson and R. W. Heckel, Metall. Trans. A, 12A: 1693– 1697, 1981. 69. L. S. Castleman and L. L. Seigle, Trans. Metall. Soc. AIME, 589– 596, 1958. 70. V. Raghavan, in Phase Diagrams of Ternary Iron Alloys, London: The Institute of Metals, 1987, p. 43. 71. T. Guraya, B. Aleman, and J. J. Urcola, in M. Fuentes et al. ), Key Engineering Materials, Switzerland: Tarns Tech, 1997, Vols.

SEM micrographs showing the AISI 4130/Ni/Cu/V/Ti64 interface: (a) after bonding by hot isostatic pressing (HIP) and (b) the same as (a) plus a heat treatment of 15 min at 960ЊC followed by 60 min at 550ЊC. BIMETALS 333 Figure 13. 2% proof stress, ultimate tensile strength, and ductility as a function of the tempering temperature: (a) AISI 4130/Incoloy 825 combination (82) and (b) AISI 4130/ Duplex Stainless Steel (81). way, the corrosion resistance of the stainless steel cladding is recovered. MECHANICAL PROPERTIES When joining dissimilar materials, the mechanical properties of the assembly depend, first of all, on the properties of the base materials and on the quality of the bond.

Sci. , 12: 45–55, 1996. 34. N. F. Kazakov, Diffusion Bonding of Materials, Moscow: Pergamon, 1985, p. 172. 35. D. A. Porter and K. E. Easterling, Diffusion, Phase Transformations in Metals and Alloys, London: Chapman & Hall, 1992, pp. 61–109. 36. I. , in D. J. ), Diffusion Bonding 2, England: Elsevier, 1991, pp. 25–36. 37. B. Lo´pez, I. Gutie´rrez, and J. J. Urcola, in D. J. ), Diffusion Bonding 2, England: Elsevier, 1991, pp. 37–48. 38. R. , Metall. , 20A: 665, 1989. 39. D. V. Dunford and P. G.

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21.Electronic Materials by John G. Webster (Editor)

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